The Advantech team has accumulated a significant amount of international
experience primarily in the Microelectronics markets.
These projects have consisted of international teams with members from almost
every continent. This fact provides Advantech with a solid platform for
executing projects under many different project environments.
|
International Project
List |
| Project
Industry |
Client |
Description |
Activity |
|
|
|
|
| Data
Centers |
Tower
Inc., Philadelphia, Pa.: |
6,000
sq. ft. disaster recovery data center for financial operations. 500KVA UPS
system, PDU's, power shutdown controls, FM200 suppression system. 1000KW
emergency generator system. |
Electrical
Design |
| Microelectronics |
Analog
Devices, Phase II, Cavite Philippines |
200,000
g.s.f. with 60,000 s.f. of class 10000 cleanroom, Assembly facility |
Mechanical
and Electrical Design |
| Microelectronics |
Mosel
Vitelic - ProMos wafer fab facilities complex, Hsinchu, Taiwan: |
1,735,000
s.f. facilities complex. 200mm
submicron semiconductor wafer fabrication with 104,000 s.f. cleanroom. |
Architectural
design |
| Microelectronics |
Philips/TSMC
- Singapore |
New
100,000 SF Microelectronics facility in Malaysia |
Concept
design and project interview |
| Microelectronics |
SubMicron
Technology, Bangkok, Thailand: |
This
is a 200mm microelectronics facility containing a 572,000 s.f.
manufacturing building to accommodate 0.18 micron device processing. |
Architectural
and Electrical design |
| Microelectronics |
TSMC
Fab-4. Hsin-Chu,
Taiwan, ROC |
40,000
Square feet of class 1000 Test Area clean room. |
Architectural
and Mechanical design |
| Microelectronics |
TSMC
Fab-4. Hsin-Chu,
Taiwan, ROC |
80,000
Square feet of class 100 fabrication area |
Architectural
and Mechanical design |
| Microelectronics |
Wafer
Technology Malaysia - Fab 1, Kulim Hi-Tech Park, Malaysia: |
200mm, 465,000 s.f.
foundry with process space of 78,000 s.f, Class 100. |
Architectural
and Electrical design |
